Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761503 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2017-09-12 |
| 9748216 | Apparatus and method for a component package | Chen-Shien Chen, Ching-Wen Hsiao, Ming Hung Tseng | 2017-08-29 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Wei Lin, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng +1 more | 2017-06-27 |
| 9679836 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chen-Cheng Kuo | 2017-06-13 |
| 9646894 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2017-05-09 |
| 9589941 | Multi-chip package system and methods of forming the same | Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2017-03-07 |