Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786621 | Elongated bump structures in package structure | Chita Chuang, Chen-Shien Chen, Yao-Chun Chuang | 2017-10-10 |
| 9761522 | Wireless charging package with chip integrated in coil center | Chiang-Jui Chu, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo | 2017-09-12 |
| 9748216 | Apparatus and method for a component package | Chih-Hua Chen, Chen-Shien Chen, Ching-Wen Hsiao | 2017-08-29 |
| 9741589 | Substrate pad structure | Hao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Chen-Shien Chen | 2017-08-22 |
| 9659903 | Method of manufacturing connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2017-05-23 |