Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741589 | Substrate pad structure | Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2017-08-22 |
| 9673125 | Interconnection structure | Yao-Chun Chuang, Chita Chuang, Yu-Jen Tseng, Chen-Shien Chen | 2017-06-06 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Yao-Chun Chuang +1 more | 2017-06-06 |