Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786621 | Elongated bump structures in package structure | Chen-Shien Chen, Ming Hung Tseng, Yao-Chun Chuang | 2017-10-10 |
| 9748188 | Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device | Chen-Cheng Kuo, Chen-Shien Chen, Yao-Chun Chuang | 2017-08-29 |
| 9741589 | Substrate pad structure | Hao-Juin Liu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2017-08-22 |
| 9711477 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2017-07-18 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2017-06-06 |
| 9673125 | Interconnection structure | Hao-Juin Liu, Yao-Chun Chuang, Yu-Jen Tseng, Chen-Shien Chen | 2017-06-06 |
| 9646943 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Mirng-Ji Lii | 2017-05-09 |