Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673125 | Interconnection structure | Hao-Juin Liu, Yao-Chun Chuang, Chita Chuang, Chen-Shien Chen | 2017-06-06 |
| 9646923 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2017-05-09 |
| 9536850 | Package having substrate with embedded metal trace overlapped by landing pad | Chen-Hua Yu, Mirng-Ji Lii, Chen-Shien Chen | 2017-01-03 |