Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824992 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2017-11-21 |
| 9748301 | Semiconductor structure and manufacturing method thereof | Chia-Yu Wei, Chin-Hsun Hsiao, Yi-Hsing Chu, Yung-Lung Hsu, Hsin-Chi Chen | 2017-08-29 |
| 9679862 | Semiconductor device having conductive bumps of varying heights | Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2017-06-13 |
| 9646923 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2017-05-09 |
| 9633965 | Semiconductor structure and manufacturing method of the same | Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Yu-Feng Chen, Sheng-Yu Wu | 2017-04-25 |
| 9625365 | System and method for monitoring particles in solution | Hsin-Chia Ho, Guo-Dung Chen, Wei-En Fu | 2017-04-18 |
| 9583367 | Methods and apparatus for bump-on-trace chip packaging | Chang-Chia Huang, Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo | 2017-02-28 |
| 9559069 | Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof | Yu-Feng Chen, Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo | 2017-01-31 |