Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824992 | Bump structure having a side recess and semiconductor structure including the same | Tin-Hao Kuo, Chen-Shien Chen, Yen-Liang Lin | 2017-11-21 |
| 9548245 | Isolation rings for packages and the method of forming the same | Tin-Hao Kuo, Tsung-Fu Tsai, Min-Feng Ku | 2017-01-17 |