Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825601 | Differential two-stage amplifier and operation method thereof | Herming Chiueh | 2017-11-21 |
| 9780009 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Hsien-Wei Chen, Wen-Hsiung Lu, Yian-Liang Kuo | 2017-10-03 |
| 9659890 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2017-05-23 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen, Han-Ping Pu | 2017-04-11 |
| 9548245 | Isolation rings for packages and the method of forming the same | Chih-Horng Chang, Tin-Hao Kuo, Min-Feng Ku | 2017-01-17 |