Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711477 | Dummy flip chip bumps for reducing stress | Tin-Hao Kuo, Chita Chuang, Chen-Shien Chen | 2017-07-18 |
| 9679862 | Semiconductor device having conductive bumps of varying heights | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2017-06-13 |
| 9646943 | Connector structure and method of forming same | Chen-Shien Chen, Mirng-Ji Lii, Chita Chuang | 2017-05-09 |
| 9633965 | Semiconductor structure and manufacturing method of the same | Yen-Liang Lin, Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Yu-Feng Chen | 2017-04-25 |
| 9583367 | Methods and apparatus for bump-on-trace chip packaging | Chang-Chia Huang, Chen-Shien Chen, Tin-Hao Kuo, Yen-Liang Lin | 2017-02-28 |
| 9559069 | Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof | Yu-Feng Chen, Chen-Shien Chen, Tin-Hao Kuo, Yen-Liang Lin | 2017-01-31 |