Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786617 | Chip packages and methods of manufacture thereof | Zi-Jheng Liu, Chung-Shi Liu, Hung-Jui Kuo, Yu-Hsiang Hu | 2017-10-10 |
| 9768138 | Improving the strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Ming-Fa Chen, Rung-De Wang | 2017-09-19 |
| 9748188 | Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device | Chita Chuang, Chen-Shien Chen, Yao-Chun Chuang | 2017-08-29 |
| 9679836 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen | 2017-06-13 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2017-06-06 |
| 9659903 | Method of manufacturing connector structures of integrated circuits | Shang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2017-05-23 |