MC

Ming-Hong Cha

TSMC: 1 patents #1,425 of 2,832Top 55%
📍 Baoshan, TW: #125 of 388 inventorsTop 35%
Overall (2017): #310,611 of 506,227Top 65%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9673161 Bonded structures for package and substrate Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more 2017-06-06