Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735087 | Wafer level embedded heat spreader | Wei Sen Chang, Yen-Chang Hu, Ching-Wen Hsiao | 2017-08-15 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2017-06-06 |
| 9659896 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Guan-Yu Chen, Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2017-05-23 |
| 9580394 | Benzodiazepine derivative and method of producing the same | YU CHANG, Ching-Yun Lee, Cheng-Fang Hsu | 2017-02-28 |