Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9773755 | Substrate interconnections having different sizes | Ying-Ching Shih, Chen-Shien Chen, Ming-Fa Chen | 2017-09-26 |
| 9768138 | Improving the strength of micro-bump joints | Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen, Rung-De Wang | 2017-09-19 |