Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818697 | Semiconductor package manufacturing method | Jing-Cheng Lin, Po-Hao Tsai, Szu-Wei Lu | 2017-11-14 |
| 9773724 | Semiconductor devices, methods of manufacture thereof, and semiconductor device packages | I-Ting Chen, Po-Hao Tsai, Szu-Wei Lu, Jing-Cheng Lin | 2017-09-26 |
| 9773755 | Substrate interconnections having different sizes | Wen-Wei Shen, Chen-Shien Chen, Ming-Fa Chen | 2017-09-26 |
| 9704825 | Chip packages and methods of manufacture thereof | Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu | 2017-07-11 |
| 9662872 | De-bonding and cleaning process and system | Jing-Cheng Lin, Szu-Wei Lu | 2017-05-30 |
| 9570421 | Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2017-02-14 |