Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837366 | Semicondcutor structure and semiconductor manufacturing process thereof | Chen-Hsun Liu, Chin-Yu Ku, Wei-Lun Hsieh, Chia-Hua Wang, Jheng-Hong Chen +1 more | 2017-12-05 |
| 9768138 | Improving the strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Ming-Fa Chen | 2017-09-19 |