Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9841246 | Dual material vapor chamber and upper shell thereof | — | 2017-12-12 |
| 9837292 | Underfill dispensing with controlled fillet profile | Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang | 2017-12-05 |
| 9834866 | Manufacturing method for transparent fiber | Shang-Chih Chou, Chun-Hung Chen | 2017-12-05 |
| 9792968 | Self-timed reset pulse generator and memory device with self-timed reset pulse generator | Chih-Chun Chen, Cheng-Da Huang | 2017-10-17 |
| 9781773 | Method of heating/cooling a substrate | Jui-Chun Peng, Jacky Chung, Heng-Hsin Liu | 2017-10-03 |
| 9748212 | Shadow pad for post-passivation interconnect structures | Shih-Wei Liang, Bor-Rung Su, Chang-Pin Huang, Chien-Chia Chiu, Hsien-Ming Tu +1 more | 2017-08-29 |
| 9728427 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2017-08-08 |
| 9678009 | Method for localized surface plasmon resonance sensing system | Wen-Yu Chen | 2017-06-13 |
| 9677820 | Electronic device and liquid cooling heat dissipation structure thereof | Shui-Fa Tsai | 2017-06-13 |
| 9673184 | Packages with molding material forming steps | Yu-Chen Hsu, Yu-Feng Chen, Han-Ping Pu | 2017-06-06 |
| 9570381 | Semiconductor packages and related manufacturing methods | Chun-Ting Lu, Yi-Ting Chen | 2017-02-14 |
| 9553065 | Bumps for chip scale packaging including under bump metal structures with different diameters | Yu-Feng Chen, Tsung-Shu Lin, Han-Ping Pu, Hsien-Wei Chen | 2017-01-24 |
| 9549133 | Image capture device, and defective pixel detection and correction method for image sensor array | — | 2017-01-17 |