Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847317 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng | 2017-12-19 |
| 9728427 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2017-08-08 |
| 9601353 | Packages with molding structures and methods of forming the same | Cheng-Tar Wu, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2017-03-21 |