Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837292 | Underfill dispensing with controlled fillet profile | Jung Wei Cheng, Chun-Hung Lin, Tsung-Ding Wang | 2017-12-05 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin +2 more | 2017-06-27 |
| 9564416 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Jung Wei Cheng, Tsung-Ding Wang, Hung-Jen Lin | 2017-02-07 |