Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793242 | Packages with die stack including exposed molding underfill | Yu-Chih Liu, Wei-Ting Lin, Jing Ruei Lu, Tsung-Ding Wang | 2017-10-17 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Chien-Hsun Lee, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2017-06-27 |