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Wei-Ting Lin

TSMC: 6 patents #331 of 2,832Top 15%
JC J-Metrics Technology Co.: 3 patents #1 of 4Top 25%
NU National Sun Yat-Sen University: 1 patents #20 of 71Top 30%
TL Top Victory Investments Limited: 1 patents #1 of 9Top 15%
📍 Lake Zurich, IL: #2 of 52 inventorsTop 4%
🗺 Illinois: #70 of 8,424 inventorsTop 1%
Overall (2017): #5,387 of 506,227Top 2%
11
Patents 2017

Issued Patents 2017

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
9805997 Packaging methods for semiconductor devices with encapsulant ring Yu-Chih Liu, Chien-Kuo Chang, Kuan-Lin Ho, Chin-Liang Chen, Shih-Yen Lin 2017-10-31
9793242 Packages with die stack including exposed molding underfill Yu-Chih Liu, Hai-Ming Chen, Jing Ruei Lu, Tsung-Ding Wang 2017-10-17
9786520 Semiconductor device and manufacturing method thereof Yu-Chih Liu, Chang-Chia Huang, Shih-Yen Lin, Chin-Liang Chen, Kuan-Lin Ho 2017-10-10
9735043 Semiconductor packaging structure and process Kuan-Lin Ho, Chin-Liang Chen, Yu-Chih Liu, Shih-Yen Lin 2017-08-15
9684811 Suspended capacitive fingerprint sensor and method for manufacturing the same 2017-06-20
9679188 Fingerprint sensor packaging module and manufacturing method thereof 2017-06-13
9673119 System and method for bonding package lid Shih-Yen Lin, Yu-Chih Liu, Chin-Liang Chen, Kuan-Lin Ho 2017-06-06
9661794 Method of manufacturing package structure Shou-Zen Chang, Chen-Hua Yu, Chung-Shi Liu, Kai-Chiang Wu 2017-05-23
9632632 Touch module and method of fabricating the same Yung-Shin Liou 2017-04-25
9563015 Optical waveguide structure and manufacturing method thereof Yi-Jen Chiu, Yi-Jhe Chen, Chung-Yi Lin 2017-02-07
9553062 Fingerprint identification device Chen-Chih Fan, Shih-Chun Kuo 2017-01-24