Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818722 | Package structure and method for manufacturing thereof | Chuei-Tang Wang, Kai-Chiang Wu, Chieh-Yen Chen, Yen-Ping Wang | 2017-11-14 |
| 9818745 | Semiconductor devices having fin field effect transistor (FinFET) structures and manufacturing and design methods thereof | Tung Ying Lee, Wen-Huei Guo, Chih-Hao Chang | 2017-11-14 |
| 9661794 | Method of manufacturing package structure | Chen-Hua Yu, Chung-Shi Liu, Kai-Chiang Wu, Wei-Ting Lin | 2017-05-23 |
| 9601439 | Semiconductor structure and manufacturing method thereof | Tzu-Chun Tang, Wei-Ting Chen, In-Tsang Lin, Vincent Chen, Chuei-Tang Wang +2 more | 2017-03-21 |