Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818722 | Package structure and method for manufacturing thereof | Chuei-Tang Wang, Kai-Chiang Wu, Chieh-Yen Chen, Shou-Zen Chang | 2017-11-14 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-10-31 |
| 9653417 | Method for singulating packaged integrated circuits and resulting structures | Ming-Kai Liu, Kai-Chiang Wu | 2017-05-16 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Chia-Chun Miao, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2017-04-18 |
| 9596729 | Dimmable switching mode LED driving circuit without phase angle measurement | Wen-Hung Huang | 2017-03-14 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-01-31 |
| 9543263 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang | 2017-01-10 |