Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-10-31 |
| 9698079 | Barrier structures between external electrical connectors | Shih-Wei Liang, Kai-Chiang Wu | 2017-07-04 |
| 9653341 | Semiconductor structure and manufacturing method thereof | Chao-Wen Shih, Shih-Wei Liang, Ching-Feng Yang | 2017-05-16 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2017-04-18 |
| 9608023 | Edge reflection reduction | Yin Qian, Chao-Hung Lin, Chen Lu, Dyson H. Tai, Ming Zhang +1 more | 2017-03-28 |
| 9590005 | High dynamic range image sensor with reduced sensitivity to high intensity light | Yin Qian, Ming Zhang, Chen Lu, Jin Li, Dyson H. Tai | 2017-03-07 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-01-31 |
| 9543373 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu | 2017-01-10 |