Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-10-31 |
| 9659879 | Semiconductor device having a guard ring | Ching-Feng Yang, Kai-Chiang Wu, Vincent Chen | 2017-05-23 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Chia-Chun Miao, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang +1 more | 2017-04-18 |
| 9601439 | Semiconductor structure and manufacturing method thereof | Tzu-Chun Tang, Shou-Zen Chang, Wei-Ting Chen, In-Tsang Lin, Vincent Chen +2 more | 2017-03-21 |
| 9576874 | Semiconductor devices and methods of manufacture thereof | Yu-Feng Chen, Kai-Chiang Wu, Hung-Jui Kuo | 2017-02-21 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-01-31 |