Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9805997 | Packaging methods for semiconductor devices with encapsulant ring | Yu-Chih Liu, Wei-Ting Lin, Kuan-Lin Ho, Chin-Liang Chen, Shih-Yen Lin | 2017-10-31 |
| 9666556 | Flip chip packaging | Yu-Chih Liu, Chi-Yang Yu, Jing Ruei Lu, Chih-Hao Lin | 2017-05-30 |