Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853105 | Semiconductor device and method of formation | Meng-Yu Lin, Si-Chen Lee | 2017-12-26 |
| 9805997 | Packaging methods for semiconductor devices with encapsulant ring | Yu-Chih Liu, Chien-Kuo Chang, Wei-Ting Lin, Kuan-Lin Ho, Chin-Liang Chen | 2017-10-31 |
| 9786520 | Semiconductor device and manufacturing method thereof | Yu-Chih Liu, Chang-Chia Huang, Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin | 2017-10-10 |
| 9735043 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu | 2017-08-15 |
| 9673119 | System and method for bonding package lid | Yu-Chih Liu, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho | 2017-06-06 |
| 9577049 | Semiconductor device structure and method for forming the same | Chong-Rong Wu, Chi-Wen Liu | 2017-02-21 |