Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812410 | Lid structure for a semiconductor device package and method for forming the same | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu | 2017-11-07 |
| 9805997 | Packaging methods for semiconductor devices with encapsulant ring | Chien-Kuo Chang, Wei-Ting Lin, Kuan-Lin Ho, Chin-Liang Chen, Shih-Yen Lin | 2017-10-31 |
| 9793242 | Packages with die stack including exposed molding underfill | Hai-Ming Chen, Wei-Ting Lin, Jing Ruei Lu, Tsung-Ding Wang | 2017-10-17 |
| 9786520 | Semiconductor device and manufacturing method thereof | Chang-Chia Huang, Shih-Yen Lin, Chin-Liang Chen, Kuan-Lin Ho, Wei-Ting Lin | 2017-10-10 |
| 9735043 | Semiconductor packaging structure and process | Kuan-Lin Ho, Chin-Liang Chen, Wei-Ting Lin, Shih-Yen Lin | 2017-08-15 |
| 9673119 | System and method for bonding package lid | Shih-Yen Lin, Chin-Liang Chen, Wei-Ting Lin, Kuan-Lin Ho | 2017-06-06 |
| 9666556 | Flip chip packaging | Chien-Kuo Chang, Chi-Yang Yu, Jing Ruei Lu, Chih-Hao Lin | 2017-05-30 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2017-04-18 |