Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780064 | Method of forming package assembly | Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-10-03 |
| 9691723 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Chien-Hsun Lee, Hao-Cheng Hou, Chun-Chih Chuang +2 more | 2017-06-27 |
| 9673158 | Formation of connectors without UBM | Tsung-Ding Wang, Chien-Hsun Lee | 2017-06-06 |
| 9564416 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang | 2017-02-07 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2017-01-31 |