Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780046 | Seal rings structures in semiconductor device interconnect layers and methods of forming the same | Hsin-Yu Pan, Han-Ping Pu, Pei-Haw Tsao | 2017-10-03 |
| 9673184 | Packages with molding material forming steps | Chun-Hung Lin, Yu-Feng Chen, Han-Ping Pu | 2017-06-06 |