Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831190 | Semiconductor device package with warpage control structure | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2017-11-28 |
| 9780076 | Package-on-package structure with through molding via | Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu | 2017-10-03 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin +4 more | 2017-08-29 |
| 9721868 | Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate | Po-Yao Lin, Wen-Yi Lin, Shyue-Ter Leu, Shu-Shen Yeh | 2017-08-01 |
| 9653391 | Semiconductor packaging structure and manufacturing method thereof | Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2017-05-16 |
| 9583474 | Package on packaging structure and methods of making same | Wen-Yi Lin, Jiun Yi Wu, Jing Ruei Lu, Po-Yao Lin | 2017-02-28 |
| 9548281 | Electrical connection for chip scale packaging | Wen-Yi Lin, Fu-Jen Li, Po-Yao Lin | 2017-01-17 |
| 9543284 | 3D packages and methods for forming the same | Fu-Jen Li, Kuo-Chuan Liu, Po-Yao Lin, Wen-Yi Lin | 2017-01-10 |