Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831190 | Semiconductor device package with warpage control structure | Ming-Chih Yew, Po-Yao Lin, Kuo-Chuan Liu | 2017-11-28 |
| 9780076 | Package-on-package structure with through molding via | Ming-Chih Yew, Po-Yao Lin, Kuo-Chuan Liu | 2017-10-03 |
| 9548281 | Electrical connection for chip scale packaging | Ming-Chih Yew, Wen-Yi Lin, Po-Yao Lin | 2017-01-17 |
| 9543284 | 3D packages and methods for forming the same | Ming-Chih Yew, Kuo-Chuan Liu, Po-Yao Lin, Wen-Yi Lin | 2017-01-10 |