Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Chin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew +4 more | 2017-08-29 |
| 9653391 | Semiconductor packaging structure and manufacturing method thereof | Ming-Chih Yew, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2017-05-16 |