Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Cheng-Lin Huang, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin, Ming-Chih Yew +4 more | 2017-08-29 |
| 9721868 | Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate | Po-Yao Lin, Wen-Yi Lin, Shyue-Ter Leu, Ming-Chih Yew | 2017-08-01 |