Issued Patents 2017
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9553045 | Inductor for post passivation interconnect and a method of forming | Hsien-Wei Chen, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2017-01-24 |
| 9543259 | Semiconductor structure with oval shaped conductor | Yung-Ping Chiang, Chao-Wen Shih, Mirng-Ji Lii | 2017-01-10 |
| 9536847 | Bump pad structure | Hsiu-Ping Wei, Hsien-Wei Chen, Ying-Ju Chen, Yu-Wen Liu | 2017-01-03 |