Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812434 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Yu-Chia Lai | 2017-11-07 |
| 9786618 | Semiconductor structure and manufacturing method thereof | Chang-Pin Huang, Hsien-Ming Tu, Shih-Wei Liang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2017-10-10 |
| 9773732 | Method and apparatus for packaging pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2017-09-26 |
| 9679883 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Yu-Chia Lai | 2017-06-13 |
| 9673270 | Metal insulator metal capacitor and method for making the same | Yu-Chia Lai, Tung-Liang Shao | 2017-06-06 |
| 9646944 | Alignment structures and methods of forming same | Hsien-Wei Chen | 2017-05-09 |
| 9640498 | Integrated fan-out (InFO) package structures and methods of forming same | Chang-Pin Huang, Chen-Hua Yu, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo +3 more | 2017-05-02 |
| 9627332 | Integrated circuit structure and seal ring structure | Shih-Wei Liang, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2017-04-18 |
| 9559044 | Package with solder regions aligned to recesses | Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2017-01-31 |