Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Chun-Hui Yu, Kuo-Chung Yee, Chen-Hua Yu, Yeong-Jyh Lin, Liang-Ju Yen +1 more | 2017-02-28 |
CL
Chia-Hsiang Lin
Overall (2017): #462,390 of 506,227Top 95%
1
Patents 2017