Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812426 | Integrated fan-out package, semiconductor device, and method of fabricating the same | Chin-Te Wang, Hsien-Wei Chen, Li-Han Hsu, Tzu-Shiun Sheu, Wei-Cheng Wu +1 more | 2017-11-07 |
| 9793231 | Under bump metallurgy (UBM) and methods of forming same | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su | 2017-10-17 |
| 9741690 | Redistribution layers in semiconductor packages and methods of forming same | Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2017-08-22 |
| 9698115 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Sung-Hui Huang, Kuo-Ching Hsu | 2017-07-04 |
| 9640496 | Semiconductor device | Wei-Yu Chen, Hsien-Wei Chen, An-Jhih Su | 2017-05-02 |
| 9627288 | Package structures and methods of forming the same | Hsien-Wei Chen, Wei-Yu Chen | 2017-04-18 |