Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818720 | Structure and formation method for chip package | Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2017-11-14 |
| 9806058 | Chip package having die structures of different heights and method of forming same | Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2017-10-31 |
| 9741669 | Forming large chips through stitching | Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen | 2017-08-22 |