Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780072 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Kim Hong Chen, Wensen Hung | 2017-10-03 |
| 9735082 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2017-08-15 |
| 9595506 | Packages with thermal management features for reduced thermal crosstalk and methods of forming same | Kim Hong Chen, Wensen Hung, Shin-Puu Jeng | 2017-03-14 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Wensen Hung, An-Jhih Su, Hsiang-Fan Lee, Kim Hong Chen +2 more | 2017-02-28 |
| 9576938 | 3DIC packages with heat dissipation structures | Wensen Hung, Kim Hong Chen, Shin-Puu Jeng | 2017-02-21 |