Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735082 | 3DIC packaging with hot spot thermal management features | Wensen Hung, Szu-Po Huang, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng | 2017-08-15 |
| 9653427 | Integrated circuit package with probe pad structure | Chi-Hsi Wu, Chen-Hua Yu, Shih-Peng Tai, Tang-Jung Chiu, Wen-Chih Chiou | 2017-05-16 |
| 9583415 | Packages with thermal interface material on the sidewalls of stacked dies | Chen-Hua Yu, Wensen Hung, Szu-Po Huang, An-Jhih Su, Kim Hong Chen +2 more | 2017-02-28 |