Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653427 | Integrated circuit package with probe pad structure | Chi-Hsi Wu, Chen-Hua Yu, Hsiang-Fan Lee, Shih-Peng Tai, Wen-Chih Chiou | 2017-05-16 |
TC
Tang-Jung Chiu
Overall (2017): #227,257 of 506,227Top 45%
1
Patents 2017