Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812381 | Integrated fan-out package and method of fabricating the same | Chi-Hsi Wu, Chun-Yi Liu, Der-Chyang Yeh, Hsien-Wei Chen, Chuen-De Wang | 2017-11-07 |
| 9659863 | Semiconductor devices, multi-die packages, and methods of manufacture thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh | 2017-05-23 |
| 9653427 | Integrated circuit package with probe pad structure | Chi-Hsi Wu, Chen-Hua Yu, Hsiang-Fan Lee, Tang-Jung Chiu, Wen-Chih Chiou | 2017-05-16 |