Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768048 | Package on-package structure | Chih-Wei Lin, Hui-Min Huang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9576888 | Package on-package joint structure with molding open bumps | Meng-Tse Chen, Chun-Cheng Lin, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |