Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842829 | Chip package structure and method for forming the same | Hsien-Wei Chen, An-Jhih Su | 2017-12-12 |
SC
Shao-Yun Chen
Overall (2017): #246,560 of 506,227Top 50%
1
Patents 2017