JC

Jung-Hua Chang

TSMC: 1 patents #1,425 of 2,832Top 55%
📍 Dashulong, TW: #87 of 149 inventorsTop 60%
Overall (2017): #360,798 of 506,227Top 75%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9711472 Solder bump for ball grid array Cheng-Lin Huang, Jing-Cheng Lin 2017-07-18