Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9662812 | Methods for molding integrated circuits | Chih-Hao Chen, Yi-Lin Tsai, Jui-Pin Hung, Jing-Cheng Lin | 2017-05-30 |
| 9595510 | Structure and formation method for chip package | Jui-Pin Hung, Cheng-Lin Huang, Shin-Puu Jeng | 2017-03-14 |
| 9583424 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Jui-Pin Hung, Min-Chen Lin | 2017-02-28 |