Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583424 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Jui-Pin Hung, Hsien-Wen Liu | 2017-02-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583424 | Integrated circuit structure and method for reducing polymer layer delamination | Jing-Cheng Lin, Jui-Pin Hung, Hsien-Wen Liu | 2017-02-28 |