Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824989 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Jing-Cheng Lin, Cheng-Lin Huang | 2017-11-21 |
| 9553000 | Interconnect structure for wafer level package | Chen-Hua Yu, Jing-Cheng Lin, Jui-Pin Hung, Shin-Puu Jeng | 2017-01-24 |