Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818729 | Package-on-package structure and method | Sheng-Hsiang Chiu, Meng-Tse Chen, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2017-11-14 |
| 9799625 | Semiconductor structure and manufacturing method thereof | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2017-10-24 |
| 9754805 | Packaging method and structure | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2017-09-05 |
| 9640428 | Self-aligned repairing process for barrier layer | Chih-Chien Chi, Chung-Chi Ko, Mei-Ling Chen, Huang-Yi Huang, Szu-Ping Tung | 2017-05-02 |
| 9614052 | Copper contact plugs with barrier layers | Li-Lin Su, Huang-Ming Chen, Hsueh Wen Tsau | 2017-04-04 |
| 9589800 | Method for integrated circuit patterning | Szu-Ping Tung, Huang-Yi Huang, Neng-Jye Yang | 2017-03-07 |
| 9576892 | Semiconductor devices and methods of forming same | Chih-Chien Chi, Huang-Yi Huang, Szu-Ping Tung | 2017-02-21 |
| 9567668 | Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method | Chih-Chien Chi, Shing-Chyang Pan, Kuan-Chia Chen, Yao-Jen Chang, Huang-Yi Huang | 2017-02-14 |
| 9543198 | Structure and method for forming interconnect structure | Chih-Chien Chi, Huang-Yi Huang, Szu-Ping Tung | 2017-01-10 |