Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9805951 | Method of integration process for metal CMP | Pei-Hsuan Lee, Hung-Wen Su | 2017-10-31 |
| 9754822 | Interconnect structure and method | Chia-Cheng Chou, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2017-09-05 |
| 9754882 | Interconnect structure having air gap and method of forming the same | Hung-Wen Su | 2017-09-05 |
| 9640428 | Self-aligned repairing process for barrier layer | Chung-Chi Ko, Mei-Ling Chen, Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2017-05-02 |
| 9576892 | Semiconductor devices and methods of forming same | Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2017-02-21 |
| 9567668 | Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method | Shing-Chyang Pan, Kuan-Chia Chen, Yao-Jen Chang, Huang-Yi Huang, Ching-Hua Hsieh | 2017-02-14 |
| 9543198 | Structure and method for forming interconnect structure | Huang-Yi Huang, Szu-Ping Tung, Ching-Hua Hsieh | 2017-01-10 |